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Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g

Home » Tools » Welding & Soldering Supplies » Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g
Enlarge Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g
Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g enlarge
Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g enlarge
Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g enlarge
Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g enlarge
Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g enlarge
Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g enlarge
Price from: 63.64 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Tin Liquid 183℃ solder paste SMT Lead-bearing LED PCB LED SMD SMT Solder Paste BGA Soldering Flux 63/37 tin mud cream 500g
Introducing our high-quality Tin Liquid 183℃ solder paste, the perfect solution for all your soldering needs. This solder paste is specially formulated to provide excellent performance and reliability in Surface Mount Technology (SMT) applications. With its lead-bearing composition, it ensures secure connections and superior conductivity, making it an ideal choice for PCB assembly, particularly for LED applications.

Designed to meet the demands of the modern electronics industry, our Tin Liquid 183℃ solder paste is specifically tailored for LED PCBs and SMD components. Its exceptional thermal stability allows for efficient soldering at high temperatures, ensuring the longevity and durability of your electronic devices. The 63/37 tin mud cream composition guarantees a perfect balance between strength and flexibility, providing reliable joints that can withstand harsh operating conditions.

This 500g jar of solder paste is a cost-effective solution for both small-scale and large-scale manufacturing processes. The included BGA soldering flux enhances the wetting ability and flow characteristics of the solder, resulting in precise and consistent solder joints. Whether you are a professional electronics manufacturer or an avid hobbyist, our Tin Liquid 183℃ solder paste is an essential tool for achieving high-quality soldering and ensuring the flawless performance of your LED PCBs and SMD components.

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