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For SM8475 AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating

Home » Tools » Welding & Soldering Supplies » For SM8475 AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating
Enlarge For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating
For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating enlarge
For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating enlarge
For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating enlarge
For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating enlarge
For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating enlarge
For SM8475  AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating enlarge
Price from: 55.50 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

For SM8475 AMAOE BGA Reballing Stencil Snapdragon 8+ 8Gen1 888 SM8450 8350 CPU Tin Planting Steel Mesh Rework Heating
Introducing the SM8475 AMAOE BGA Reballing Stencil, a cutting-edge tool designed for efficient and precise reballing of Snapdragon 8+ 8Gen1 888 SM8450 8350 CPUs. This high-quality stencil is crafted from durable steel mesh, ensuring long-lasting performance and resistance to heat. With its precise tin planting design, this stencil enables seamless reballing of BGA components, making it an essential tool for professionals in the electronics industry.

The SM8475 AMAOE BGA Reballing Stencil is specifically designed to cater to the needs of reworking and heating processes. Its innovative construction allows for efficient heat transfer, ensuring optimal performance during reballing procedures. The stencil's compatibility with Snapdragon 8+ 8Gen1 888 SM8450 8350 CPUs makes it an ideal choice for technicians and engineers working with these advanced processors.

This reballing stencil is not only highly functional but also user-friendly. Its compact size and lightweight design make it easy to handle and maneuver, even in tight spaces. The stencil's tin planting feature enables precise placement of solder balls, minimizing the risk of errors and ensuring a reliable connection. Whether you are a professional technician or an electronics enthusiast, the SM8475 AMAOE BGA Reballing Stencil is an indispensable tool for achieving impeccable reballing results.

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