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BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip

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Enlarge BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip
BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip enlarge
BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip enlarge
BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip enlarge
BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip enlarge
BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip enlarge
BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip enlarge
Price from: 55.20 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

BGA Repairing Kit Jig Stencils 90mm 250K Solder Balls Solder Flux Paste For Reballing Game Console Desktop Chip
Introducing the BGA Repairing Kit Jig Stencils, the ultimate solution for reballing game console desktop chips. This kit includes a set of high-quality jig stencils that are specifically designed to make the reballing process quick and efficient. With a size of 90mm, these stencils provide precise alignment and ensure accurate solder ball placement, saving you time and effort.

Included in this kit are 250K solder balls, which are made from premium materials to guarantee excellent conductivity and durability. These solder balls are essential for reballing BGA chips, ensuring a secure and reliable connection for your game console or desktop chip. With this abundant quantity, you can confidently work on multiple repairs without worrying about running out of solder balls.

To ensure a successful reballing process, this kit also includes solder flux paste. This paste is specifically formulated to remove oxidation and contaminants, allowing for better solder flow and adhesion. With its high-quality composition, this flux paste ensures excellent wetting properties and reduces the chances of solder bridges or cold joints. Trust the BGA Repairing Kit Jig Stencils, along with the 250K solder balls and solder flux paste, to provide you with the tools needed for a professional and efficient reballing experience for your game console or desktop chip.

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