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AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM

Home » Tools » Welding & Soldering Supplies » AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM
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AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM enlarge
AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM enlarge
AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM enlarge
AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM enlarge
AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM enlarge
Price from: 64.08 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

AMAOE SR15F BGA Reballing Stencil Kit for Notebook CPU IC 4th Generation Reballing Tin Plant Net Platform Steel Mesh 0.3MM
The AMAOE SR15F BGA Reballing Stencil Kit is a comprehensive solution designed specifically for reballing notebook CPU ICs of the 4th generation. This kit includes a high-quality steel mesh platform with a thickness of 0.3mm, ensuring durability and precision during the reballing process. The steel mesh platform provides a stable base for accurate reballing, allowing for seamless alignment of the stencil with the IC.

The reballing stencil included in this kit is made with utmost precision to ensure optimal results. With its fine craftsmanship, the stencil perfectly fits the notebook CPU ICs of the 4th generation. The stencil features a tin plant net design, which facilitates the reballing process by evenly distributing the tin balls onto the IC. This results in improved soldering and enhanced performance of the IC.

The AMAOE SR15F BGA Reballing Stencil Kit is a must-have tool for professionals in the electronics industry. It offers a reliable and efficient solution for reballing notebook CPU ICs of the 4th generation. With its high-quality steel mesh platform and precision-made stencil, this kit ensures accurate alignment and optimal soldering results. Upgrade your reballing process with the AMAOE SR15F BGA Reballing Stencil Kit and achieve superior performance for notebook CPU ICs.

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