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Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh

Home » Tools » Welding & Soldering Supplies » Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh
Enlarge Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh
Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh enlarge
Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh enlarge
Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh enlarge
Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh enlarge
Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh enlarge
Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh enlarge
Price from: 50.25 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe Mbga-B8 BGA Reballing Platform for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Board Steel Mesh
The Amaoe Mbga-B8 BGA Reballing Platform is an essential tool for repairing Android mobile phone CPUs. This platform is specifically designed to assist in the process of reballing, which involves removing the existing solder balls from the CPU and replacing them with new ones. The platform provides a stable and secure base for precise reballing, ensuring successful repairs and optimal performance of the mobile phone.

With its tin planting feature, the Amaoe Mbga-B8 platform simplifies the process of applying solder paste to the CPU. This feature allows for accurate and efficient tin planting, reducing the risk of errors and improving the overall quality of the reballing process. The platform also includes a glue removal positioning board, which aids in the precise removal of excess adhesive or glue from the CPU, ensuring a clean and professional finish.

The Amaoe Mbga-B8 BGA Reballing Platform is constructed with high-quality steel mesh, providing durability and stability during the reballing process. The steel mesh enhances heat conduction, ensuring even distribution and preventing overheating of the CPU. The platform's design is user-friendly, allowing for easy setup and operation. Whether you are a professional technician or a DIY enthusiast, the Amaoe Mbga-B8 BGA Reballing Platform is an indispensable tool for efficient and reliable repairs of Android mobile phone CPUs.

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