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Amaoe LGE2136 BGA Reballing Stencil For LCD Chip BGA 0.2MM Mobile Phone Maintenance Tools Tin Plant Net Steel Mesh

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Price from: 56.68 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe LGE2136 BGA Reballing Stencil For LCD Chip BGA 0.2MM Mobile Phone Maintenance Tools Tin Plant Net Steel Mesh
The Amaoe LGE2136 BGA Reballing Stencil is a must-have tool for professionals in the field of mobile phone maintenance. Specifically designed for LCD chip BGA reballing, this stencil is perfect for repairing and replacing damaged components in mobile phones. With a thickness of 0.2mm, it ensures precision and accuracy during the reballing process, guaranteeing excellent results.

Crafted from high-quality tin plant net steel mesh, the Amaoe LGE2136 BGA Reballing Stencil offers durability and longevity. This sturdy construction ensures that the stencil withstands the rigors of everyday use, making it a reliable tool for mobile phone repair technicians. The steel mesh design allows for efficient heat dissipation, preventing overheating and ensuring the safety of the delicate LCD chip during the reballing procedure.

Featuring a user-friendly design, this stencil is easy to handle and operate. Its precise cutouts and well-defined patterns make it simple to align and position the stencil accurately on the LCD chip. This ensures a seamless reballing process, minimizing the risk of errors and enhancing the overall efficiency of mobile phone maintenance. The Amaoe LGE2136 BGA Reballing Stencil is an indispensable tool for professionals seeking reliable and effective solutions for LCD chip BGA reballing in mobile phone repair.

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