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Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm

Home » Tools » Welding & Soldering Supplies » Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm
Enlarge Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm
Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm enlarge
Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm enlarge
Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm enlarge
Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm enlarge
Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm enlarge
Price from: 59.90 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set Car Chipset IC Reballing Magnetic Base Platform Tin Plant Mesh 0.2mm
Introducing the Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set, a comprehensive solution for all your car chipset IC reballing needs. This high-quality solder set comes with a magnetic base platform and a tin plant mesh, ensuring precision and efficiency in your reballing process. The BGA stencil, with a thickness of 0.2mm, guarantees accurate and reliable soldering, making it an indispensable tool for professionals and DIY enthusiasts alike.

The magnetic base platform of the Amaoe DRA655ATSCICYEQ1 solder set provides a stable and secure foundation for your reballing tasks. Its strong magnetic force firmly holds the BGA stencil in place, preventing any unwanted movement during the soldering process. This feature enables precise alignment and minimizes the risk of errors, ensuring optimal soldering results every time.

The tin plant mesh included in this solder set is made of high-quality materials, allowing for even distribution of the solder paste onto the car chipset IC. With a thickness of 0.2mm, the mesh provides excellent control over the amount of solder applied, preventing excess or insufficient soldering. This precise application ensures the integrity and functionality of the car chipset IC, making the Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set an essential tool for any reballing task.

In conclusion, the Amaoe DRA655ATSCICYEQ1 BGA Stencil Solder Set is

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