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Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template

Home » Tools » Welding & Soldering Supplies » Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template
Enlarge Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template
Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template enlarge
Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template enlarge
Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template enlarge
Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template enlarge
Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template enlarge
Price from: 59.98 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe BGA Reballing Stencil for DDR5 DDR6 BGA170 BGA180 Location Platform Magnet Base Tin Planting Steel Mesh IC Solder Template
Introducing the Amaoe BGA Reballing Stencil, the ultimate tool for reballing DDR5 and DDR6 BGA170 and BGA180 chips. This high-quality stencil is designed to provide accurate and efficient reballing of integrated circuits (ICs) with ease. Whether you are a professional technician or a DIY enthusiast, this stencil is a must-have for any BGA rework project.

The stencil features a location platform that ensures precise alignment of the chip, allowing for a seamless reballing process. With its magnet base, the stencil securely attaches to the work surface, providing stability and preventing any accidental movements during the reballing procedure. This feature is especially beneficial when dealing with delicate and small-sized chips, as it minimizes the risk of damage.

Crafted from durable tin planting steel mesh, this stencil guarantees longevity and reliability. Its robust construction ensures that it can withstand repeated use without compromising its performance. The IC solder template is designed to facilitate the even distribution of solder balls, resulting in a uniform and consistent reballing process. With the Amaoe BGA Reballing Stencil, you can confidently tackle any BGA rework project, knowing that you have a reliable and efficient tool at your disposal.

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