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Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632

Home » Electronic Components & Supplies » Active Components » Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632
Enlarge Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632
Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632 enlarge
Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632 enlarge
Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632 enlarge
Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632 enlarge
Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632 enlarge
Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632 enlarge
Price from: 50.92 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe MBGA-B5 Planting Tin Platform/Android Phone CPU BGA Reballing Stencil SDM439 MSM8917 RAM 556 SM7225 MSM8953 SDM450 SDM632
Introducing the Amaoe MBGA-B5 Planting Tin Platform, an essential tool for all your BGA reballing needs. This versatile platform is specifically designed for Android phone CPUs, making it a must-have for technicians and DIY enthusiasts alike. With its high-quality construction and compatibility with various models such as SDM439, MSM8917, RAM 556, SM7225, MSM8953, SDM450, and SDM632, this reballing stencil ensures precise and efficient reballing operations.

The Amaoe MBGA-B5 Planting Tin Platform is engineered with utmost precision, guaranteeing optimal performance and reliability. Its durable construction ensures long-lasting use, making it a valuable addition to any professional repair shop or hobbyist's toolkit. With this platform, you can effortlessly reball CPUs on Android phones, saving time and effort while achieving excellent results.

Featuring compatibility with a wide range of models, including SDM439, MSM8917, RAM 556, SM7225, MSM8953, SDM450, and SDM632, the Amaoe MBGA-B5 Planting Tin Platform provides versatility and convenience. Whether you're a professional technician or an avid DIYer, this reballing stencil is an indispensable tool that simplifies the process and ensures accurate reballing for various Android phone CPUs. Upgrade your repair arsenal with the Amaoe MBGA-B5 Planting Tin Platform and experience efficient and hassle-free BGA reball

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